Kuo: iPhone SE 2 To Use Same SLP Motherboard Tech Found On iPhone 11 Series

Tian Feng International analyst Ming-Chi said in a new research report today that Apple will stop selling iPhone models equipped with Any-layer HDI motherboard (including iPhone 7 series and earlier models) in the third quarter of 2019, they will be replaced with models that are expected to feature a more eminent SLP (short for Substrate-like PCB) motherboard than the Any-layer HDI.

Kuo went on to suggest that the iPhone SE 2, which is scheduled to be released in the first quarter of 2020, will use a 10-layer motherboard with an SLP amidst a line width of 25–30 μm. He previously predicted that the device would come in a 4.7-inch display, a single-lens rear camera, and a Touch ID fingerprint sensor, as well as the same A13 chip that's in the ‌iPhone 11‌ and 11 Pro, and to have 3GB RAM.

In the meantime, Ming-Chi Kuo estimated that the iPhone SE 2 will ship at least 20 million units in 2020.

Additionally, the noted analyst believes that the iPhones to be debuted in 2020 will all support 5G.

The major suppliers said to include Pending Holdings, Xinxing, and AT&S. It's that Pending Holdings who would have the capacity advantage, however, Xinxing and AT&S will be the main winners considering the proportion of supplies they have to offer.

Lastly, Kuo concludes that the unit price of the new 5G iPhones will be 30–35% higher than the iPhone 11 series, this means that the base model of the cheapest 5G iPhone may cost more than $1,000.

Image via Mashable